The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2017

Filed:

Sep. 13, 2016
Applicant:

Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);

Inventors:

Hung Tat Chan, Tin Shui Wai, HK;

Ka Ming Yip, Tai Wai, HK;

Chit Yiu Chan, Shatin, HK;

Kwok Wai Yee, Yuen Long, HK;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/16 (2006.01); C23C 18/18 (2006.01); C23C 18/38 (2006.01); C09K 13/00 (2006.01); C23C 18/22 (2006.01); C23C 18/20 (2006.01);
U.S. Cl.
CPC ...
C23C 18/1639 (2013.01); C23C 18/1605 (2013.01); C23C 18/1893 (2013.01); C23C 18/38 (2013.01); C09K 13/00 (2013.01); C23C 18/1641 (2013.01); C23C 18/2013 (2013.01); C23C 18/22 (2013.01);
Abstract

Shielding coatings are applied to polymer substrates for selective metallization of the substrates. The shielding coatings include a primer component and a hydrophobic top coat. The primer is first applied to the polymer substrate followed by application of the top coat component. The shielding coating is then selectively etched to form an outline of a desired current pattern. A catalyst is applied to the patterned polymer substrate followed by electroless metal plating in the etched portions. The portions of the polymer substrate which contain the shielding coating inhibit electroless metal plating. The primers contain five-membered heterocyclic nitrogen compounds and the top coat contains hydrophobic alky organic compounds.


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