The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2017
Filed:
Nov. 27, 2013
Applicant:
Varian Semiconductor Equipment Associates, Inc., Gloucester, MA (US);
Inventors:
Connie P. Wang, Mountain View, CA (US);
Paul Murphy, Reading, MA (US);
Paul Sullivan, Wenham, MA (US);
Ludovic Godet, Boston, MA (US);
Frank Sinclair, Boston, MA (US);
Morgan Evans, Manchester, MA (US);
Assignee:
Varian Semiconductor Equipment Associates, Inc., Gloucester, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 8/36 (2006.01); C23C 14/48 (2006.01); H01L 39/14 (2006.01); H01L 39/24 (2006.01); C23C 14/02 (2006.01); C23C 14/58 (2006.01); H01B 12/02 (2006.01); H01B 13/00 (2006.01);
U.S. Cl.
CPC ...
C23C 14/48 (2013.01); C23C 14/025 (2013.01); C23C 14/5806 (2013.01); H01B 12/02 (2013.01); H01B 13/0016 (2013.01); H01B 13/0036 (2013.01); H01L 39/143 (2013.01); H01L 39/2464 (2013.01);
Abstract
A method of forming a superconductor tape, includes depositing a superconductor layer on a substrate, forming a metal layer comprising a first metal on a surface of the superconductor layer, and implanting an alloy species into the metal layer where the first metal forms a metal alloy after the implanting the alloy species.