The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2017

Filed:

Mar. 25, 2015
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Hirofumi Otaki, Tokyo, JP;

Tsuneo Torikoshi, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2014.01); H01L 21/66 (2006.01); H01L 21/306 (2006.01); H01L 21/67 (2006.01); G05B 19/418 (2006.01); B24B 37/04 (2012.01);
U.S. Cl.
CPC ...
H01L 22/20 (2013.01); B24B 37/042 (2013.01); G05B 19/41865 (2013.01); H01L 21/30625 (2013.01); H01L 21/67253 (2013.01); H01L 21/67276 (2013.01); G05B 2219/32097 (2013.01); G05B 2219/45031 (2013.01); Y02P 90/20 (2015.11);
Abstract

A substrate processing method which can increase the yield by reprocessing a substrate whose processing has been interrupted by a processing interruption command during a substrate processing is disclosed. A substrate processing method performs a predetermined processing of a substrate while sequentially transporting the substrate to a plurality of processing sections according to a preset recipe. The substrate processing method includes processing a substrate in one of the processing sections; interrupting the processing of the substrate by a processing interruption command during processing of the substrate; setting the substrate whose processing has been interrupted in a standby state; and customizing the recipe and performing reprocessing of the processing-interrupted substrate according to the customized recipe, or performing reprocessing of the processing-interrupted substrate according to a preset recipe for reprocessing.


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