The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2017

Filed:

Nov. 15, 2011
Applicants:

Chun-fai Cheng, Tin Shui Wai, HK;

An-shen Chang, Jubei, TW;

Hui-min Lin, Zhubei, TW;

Tsz-mei Kwok, Hsinchu, TW;

Hsien-ching Lo, Taoyuan, TW;

Inventors:

Chun-Fai Cheng, Tin Shui Wai, HK;

An-Shen Chang, Jubei, TW;

Hui-Min Lin, Zhubei, TW;

Tsz-Mei Kwok, Hsinchu, TW;

Hsien-Ching Lo, Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/772 (2006.01); H01L 21/336 (2006.01); H01L 21/3065 (2006.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02639 (2013.01); H01L 21/02532 (2013.01); H01L 21/3065 (2013.01); H01L 21/30604 (2013.01); H01L 21/30608 (2013.01); H01L 29/66636 (2013.01); H01L 29/66628 (2013.01); H01L 29/7848 (2013.01);
Abstract

An integrated circuit device and method for manufacturing the integrated circuit device are disclosed. The disclosed method comprises forming a wedge-shaped recess with an initial bottom surface in the substrate; transforming the wedge-shaped recess into an enlarged recess with a height greater than the height of the wedge-shaped recess; and epitaxially growing a strained material in the enlarged recess.


Find Patent Forward Citations

Loading…