The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 2017

Filed:

Sep. 29, 2015
Applicant:

Sandisk Technologies Inc., Plano, TX (US);

Inventors:

Raghuveer S. Makala, Campbell, CA (US);

Sateesh Koka, Milpitas, CA (US);

Zhenyu Lu, Milpitas, CA (US);

Somesh Peri, San Jose, CA (US);

Rahul Sharangpani, Fremont, CA (US);

Assignee:

SANDISK TECHNOLOGIES LLC, Plano, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8239 (2006.01); H01L 29/49 (2006.01); H01L 27/11524 (2017.01); H01L 27/11556 (2017.01); H01L 27/1157 (2017.01); H01L 27/11582 (2017.01); H01L 29/788 (2006.01); H01L 21/28 (2006.01); H01L 21/285 (2006.01); H01L 27/11568 (2017.01);
U.S. Cl.
CPC ...
H01L 29/4975 (2013.01); H01L 21/28273 (2013.01); H01L 21/28282 (2013.01); H01L 21/28518 (2013.01); H01L 27/1157 (2013.01); H01L 27/11524 (2013.01); H01L 27/11556 (2013.01); H01L 27/11568 (2013.01); H01L 27/11582 (2013.01); H01L 29/7883 (2013.01);
Abstract

An alternating stack of insulating layers and sacrificial material layers can be formed over a substrate. Memory stack structures and a backside trench are formed through the alternating stack. Backside recesses are formed by removing the sacrificial material layers from the backside trench selective to the insulating layers. A cobalt-semiconductor alloy portion is formed in each backside recess by reacting cobalt and a semiconductor material. Conductive material in the backside trench can be removed by an etch to electrically isolate cobalt-containing alloy portions located in different backside recesses. Electrically conductive layers including a respective cobalt-semiconductor alloy portion can be employed as word lines of a three-dimensional memory device.


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