The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2017

Filed:

Jan. 28, 2016
Applicant:

Sandisk Technologies Inc., Plano, TX (US);

Inventors:

Masatoshi Nishikawa, Yokkaichi, JP;

Hiroaki Iuchi, Yokkaichi, JP;

Masafumi Miyamoto, Yokkaichi, JP;

Assignee:

SANDISK TECHNOLOGIES LLC, Plano, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/115 (2017.01); H01L 27/11582 (2017.01); H01L 21/02 (2006.01); H01L 21/28 (2006.01); H01L 21/311 (2006.01); H01L 27/11565 (2017.01); H01L 27/11519 (2017.01); H01L 27/11524 (2017.01); H01L 27/11556 (2017.01); H01L 27/1157 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 21/02164 (2013.01); H01L 21/02274 (2013.01); H01L 21/28282 (2013.01); H01L 21/31111 (2013.01); H01L 27/1157 (2013.01); H01L 27/11519 (2013.01); H01L 27/11524 (2013.01); H01L 27/11556 (2013.01); H01L 27/11565 (2013.01);
Abstract

A vertical memory device including dual memory cells per level in each memory opening can have dielectric separator dielectric structures that protrude into a facing pair of sidewalls of the memory stack structure within the memory opening. A pair of inactive sections of a vertical semiconductor channel facing the dielectric separator dielectric structures is laterally recessed from control gate electrodes. Control of the threshold voltage of such a vertical memory device can be enhanced because of the dielectric separator dielectric structures. The fringe field from the control gate electrodes is weaker due to an increased distance between the control gate electrodes and the inactive sections of the vertical semiconductor channel. The memory stack structure can have concave sidewalls that contact the dielectric separator dielectric structures and convex sidewalls that protrude toward the control gate electrodes.


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