The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2017
Filed:
Jul. 06, 2016
Applicant:
Globalfoundries Inc., Grand Cayman, KY;
Inventors:
Tom C. Lee, Essex Junction, VT (US);
Cathryn J. Christiansen, Huntington, VT (US);
Ian A. McCallum-Cook, Burlington, VT (US);
Anthony K. Stamper, Burlington, VT (US);
Assignee:
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/544 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/78 (2013.01); H01L 23/544 (2013.01); H01L 2223/5446 (2013.01);
Abstract
Structures for a chip, as well as methods of fabricating such chip structures. The chip including a portion of a substrate, an active circuit region associated with the portion of the substrate, an interconnect structure on the active circuit region, and a crackstop extending through the interconnect structure. A groove extends through the interconnect structure to the substrate at a location exterior of the crackstop. A stress-containing layer is formed on at least a portion of the groove.