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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9831128 B1

PDFFull Text
Date of Patent:
Nov. 28, 2017

Filed:

Aug. 29, 2016

Method of processing a substrate

Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Hiroshi Morikazu, Tokyo, JP;

Karl Heinz Priewasser, Munich, DE;

Nao Hattori, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:

Greer Burns & Crain Ltd.

Primary Examiner:

Asok K Sarkar

Int. Cl.
CPC ...
H01L 21/18 (2006.01); H01L 21/304 (2006.01); H01L 21/78 (2006.01); H01L 21/428 (2006.01); H01L 23/544 (2006.01); H01L 33/00 (2010.01); H01S 5/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/304 (2013.01); H01L 21/428 (2013.01); H01L 23/544 (2013.01); H01L 33/0054 (2013.01); H01L 33/0075 (2013.01); H01S 5/021 (2013.01); H01S 5/0203 (2013.01); H01S 5/0201 (2013.01);
Abstract

The invention relates to a method of processing a substrate, having a first surface with at least one division line formed thereon and a second surface opposite the first surface. The method comprises applying a pulsed laser beam to the substrate from the side of the first surface, at least in a plurality of positions along the at least one division line, so as to form a plurality of hole regions in the substrate, each hole region extending from the first surface towards the second surface. Each hole region is composed of a modified region and a space in the modified region open to the first surface. The method further comprises removing substrate material along the at least one division line where the plurality of hole regions has been formed.

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