The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Nov. 03, 2014
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Masayuki Tanabe, Utsunomiya, JP;

Setsuo Yoshida, Saitama, JP;

Keita Sakai, Utsunomiya, JP;

Hitoshi Nakano, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); B29C 33/38 (2006.01); G05D 21/02 (2006.01); B29C 43/02 (2006.01); B29C 59/02 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B29C 33/3835 (2013.01); B29C 33/3842 (2013.01); B29C 43/021 (2013.01); G05D 21/02 (2013.01); B29C 2043/025 (2013.01); B29C 2059/023 (2013.01); B29K 2995/0027 (2013.01);
Abstract

A determination method for determining a pattern of a mold is disclosed. The pattern of the mold is used in imprint processing of forming a pattern on imprint material by performing the steps of pressing the imprint material on a substrate against the pattern of the mold in an atmosphere containing condensable gas to be liquefied due to compression, curing the imprint material, and releasing the mold from the imprint material. A processor calculates a shrinkage amount of the pattern on the imprint material. The pattern on the imprint material shrinks by desorbing condensate liquid, which is produced through liquefaction of the condensable gas between the imprint material and the pattern of the mold in the pressing step and which is dissolved in the imprint material, from the imprint material after completion of the pressing step.


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