The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2017

Filed:

Jun. 13, 2016
Applicant:

Novellus Systems, Inc., Fremont, CA (US);

Inventors:

Bryan L. Buckalew, Tualatin, OR (US);

Steven T. Mayer, Aurora, OR (US);

Thomas A. Ponnuswamy, Sherwood, OR (US);

Robert Rash, West Linn, OR (US);

Brian Paul Blackman, Newberg, OR (US);

Doug Higley, Portland, OR (US);

Assignee:

Novellus Systems, Inc., Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 7/12 (2006.01); C25D 5/02 (2006.01); C25D 5/12 (2006.01); C25D 5/56 (2006.01); H01L 21/67 (2006.01); C25D 3/12 (2006.01); H01L 21/768 (2006.01); C25D 5/00 (2006.01); C25D 21/12 (2006.01); C25D 3/30 (2006.01); H01L 21/321 (2006.01); H01L 21/288 (2006.01); C25D 21/04 (2006.01); C25D 17/00 (2006.01); H01L 21/02 (2006.01); C25D 3/38 (2006.01);
U.S. Cl.
CPC ...
C25D 7/123 (2013.01); C25D 3/12 (2013.01); C25D 3/30 (2013.01); C25D 5/00 (2013.01); C25D 5/003 (2013.01); C25D 5/022 (2013.01); C25D 5/12 (2013.01); C25D 5/56 (2013.01); C25D 17/001 (2013.01); C25D 21/04 (2013.01); C25D 21/12 (2013.01); H01L 21/02307 (2013.01); H01L 21/2885 (2013.01); H01L 21/321 (2013.01); H01L 21/67051 (2013.01); H01L 21/67138 (2013.01); H01L 21/76861 (2013.01); H01L 21/76879 (2013.01); H01L 21/76898 (2013.01); C25D 3/38 (2013.01); H01L 21/76877 (2013.01); H01L 21/76885 (2013.01);
Abstract

Disclosed are pre-wetting apparatus designs and methods. In some embodiments, a pre-wetting apparatus includes a degasser, a process chamber, and a controller. The process chamber includes a wafer holder configured to hold a wafer substrate, a vacuum port configured to allow formation of a subatmospheric pressure in the process chamber, and a fluid inlet coupled to the degasser and configured to deliver a degassed pre-wetting fluid onto the wafer substrate at a velocity of at least about 7 meters per second whereby particles on the wafer substrate are dislodged and at a flow rate whereby dislodged particles are removed from the wafer substrate. The controller includes program instructions for forming a wetting layer on the wafer substrate in the process chamber by contacting the wafer substrate with the degassed pre-wetting fluid admitted through the fluid inlet at a flow rate of at least about 0.4 liters per minute.


Find Patent Forward Citations

Loading…