The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2017
Filed:
Dec. 23, 2014
Dow Global Technologies Llc, Midland, MI (US);
Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);
Phillip D. Hustad, Natick, MA (US);
Peter Trefonas, III, Medway, MA (US);
Jong Keun Park, Westborough, MA (US);
DOW GLOBAL TECHNOLOGIES LLC, Midland, MI (US);
ROHM AND HAAS ELECTRONIC MATERIALS LLC, Marlborough, MA (US);
Abstract
Disclosed herein is a method comprising disposing a mat composition on a surface of a semiconductor substrate; where the mat composition comprises a random copolymer comprising a first acrylate unit and a second unit; where the copolymer does not comprise a polystyrene or a polyepoxide; crosslinking the random copolymer; disposing a brush backfill composition on the substrate; such that the brush backfill composition and the mat composition alternate with each other; disposing on the brush backfill composition and on the mat composition a block copolymer that undergoes self assembly; and etching the block copolymer to create uniformly spaced channels in the semiconductor substrate.