The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2017

Filed:

Sep. 29, 2015
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Ching-Huang Chen, New Taipei, TW;

Hung-Chang Hsieh, Hsin-Chu, TW;

Kuei-Liang Lu, Hsinchu, TW;

Ya Hui Chang, Hsinchu, TW;

Spencer Lin, Hsinchu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); G03F 7/20 (2006.01); G03F 9/00 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70141 (2013.01); G03F 7/70633 (2013.01); G03F 9/7076 (2013.01); H01L 22/12 (2013.01); Y10S 438/975 (2013.01);
Abstract

A device for semiconductor fabrication includes a substrate and a layer formed over the substrate, wherein the layer includes an alignment mark. The alignment mark includes a first plurality of elongated members that are oriented lengthwise along a first direction and are distributed along a second direction. The alignment mark further includes a second plurality of elongated members that are oriented lengthwise along a third direction perpendicular to the first direction and are distributed along the second direction, wherein the second direction is different from each of the first and third directions.


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