The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2017
Filed:
Aug. 12, 2014
Applicants:
Fukui Precision Component (Shenzhen) Co., Ltd., Shenzhen, CN;
Zhen Ding Technology Co., Ltd., Tayuan, Taoyuan, TW;
Inventors:
Assignees:
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
GARUDA TECHNOLOGY CO., LTD, New Taipei, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/285 (2013.01); H05K 3/282 (2013.01); H05K 2203/013 (2013.01); H05K 2203/1105 (2013.01); Y10T 29/49156 (2015.01);
Abstract
A PCB includes a base layer, a wiring pattern formed on a surface of the base layer, and a protecting layer formed on the wiring pattern. The protecting layer is formed by printing and solidifying an ink on the wiring pattern. The ink includes a cycloaliphatic epoxy resin, a phenoxyl resin solution, a solvent, a hardener, and an antifoaming agent.
Ho, Ming-Jaan. (2017). Printed circuit board and method for manufacturing same (U.S. Patent No. 9820388). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9820388
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile