The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2017
Filed:
Mar. 14, 2016
Amkor Technology, Inc., Tempe, AZ (US);
Jong Sik Paek, Incheon, KR;
Jin Young Kim, Seoul, KR;
YoonJoo Kim, Seoul, KR;
Jin Han Kim, Gyeonggi-do, KR;
SeungJae Lee, Gyeonggi-do, KR;
Se Woong Cha, Gyeonggi-do, KR;
SungKyu Kim, Seoul, KR;
Jae Hun Bae, Seoul, KR;
Dong Jin Kim, Gwangju, KR;
Doo Hyun Park, Gyeonggi-do, KR;
Amkor Technology, Inc., Tempe, AZ (US);
Abstract
A semiconductor device with redistribution layers on partial encapsulation is disclosed and may include a semiconductor die having a first surface, a second surface opposite to the first surface, and side surfaces between the first and second surfaces; an encapsulant encapsulating the side surfaces of the semiconductor die; a contact pad on the first surface of the semiconductor die; and a redistribution layer coupled to the contact pad The redistribution layer may include a linear portion and a circular pad, and a hemispherical conductive bump on the circular pad may include a protruding part extending toward the linear portion and having a radius less than the hemispherical conductive bump. The second surface of the semiconductor die may be coplanar with a surface of the encapsulant. A dielectric layer may cover a portion of the first surface of the semiconductor die and a first surface of the encapsulant.