The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2017

Filed:

Dec. 29, 2015
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Anthony K. Stamper, Essex Junction, VT (US);

Mukta G. Farooq, Hopewell Junction, NY (US);

John A. Fitzsimmons, Hopewell Junction, NY (US);

Mark D. Jaffe, Essex Junction, VT (US);

Randy L. Wolf, Essex Junction, VT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 27/13 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76256 (2013.01); H01L 27/13 (2013.01); H01L 2221/68318 (2013.01);
Abstract

Assemblies including a device layer of a silicon-on-insulator (SOI) substrate and a replacement substrate replacing a handle wafer of the SOI substrate, and methods for transferring the device layer of the SOI substrate from the handle wafer to the replacement substrate. A device structure is formed in a first section of the handle wafer, and a second section of the handle wafer adjoining the first section of the handle wafer is removed to expose a surface of the buried dielectric layer of the silicon-on-insulator substrate. A permanent substrate is attached to the surface of the buried dielectric layer. When the permanent substrate is attached to the surface of the buried dielectric layer, the section of the handle wafer is received inside a cavity defined in the permanent substrate.


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