The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2017

Filed:

May. 16, 2014
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Richard J. Green, Tracy, CA (US);

Cheng-Hsiung Tsai, Cupertino, CA (US);

Shambhu N. Roy, San Jose, CA (US);

Puneet Bajaj, Bangalore, IN;

David H. Loo, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); H01J 37/32 (2006.01); C23C 14/50 (2006.01); C23C 14/56 (2006.01); H01J 37/34 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32862 (2013.01); C23C 14/50 (2013.01); C23C 14/564 (2013.01); H01J 37/32642 (2013.01); H01J 37/32715 (2013.01); H01J 37/3408 (2013.01);
Abstract

Methods and apparatus for in-situ plasma cleaning of a deposition chamber are provided. In one embodiment a method for plasma cleaning a deposition chamber without breaking vacuum is provided. The method comprises positioning a substrate on a susceptor disposed in the chamber and circumscribed by an electrically floating deposition ring, depositing a metal film on the substrate and the deposition ring in the chamber, grounding the metal film deposited on the deposition ring without breaking vacuum, and removing contaminants from the chamber with a plasma formed in the chamber without resputtering the metal film on the grounded deposition ring and without breaking vacuum.


Find Patent Forward Citations

Loading…