The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2017

Filed:

Apr. 26, 2016
Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventors:

Kenji Sakai, Ogaki, JP;

Tomoyuki Ikeda, Ogaki, JP;

Toshiki Furutani, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H05K 1/0298 (2013.01); H05K 3/32 (2013.01); H05K 3/4644 (2013.01); H05K 2201/09009 (2013.01);
Abstract

A wiring board includes electronic components, a multilayer core substrate including insulating layers and conductive layers such that the insulating layers include a central insulating layer in the center position of the core in the thickness direction, a first build-up layer including an insulating layer and a conductive layer such that the insulating layer has resin composition different from that of the insulating layers in the core, and a second build-up layer including an insulating layer and a conductive layer such that the insulating layer has resin composition different from that of the insulating layers in the core. The core has cavities accommodating the electronic components, respectively, and including a first cavity and a second cavity such that the first and second cavities have different lengths in the thickness direction and are penetrating through the central layer at centers of the first and second cavities in the thickness direction.


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