The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 31, 2017

Filed:

Mar. 14, 2016
Applicant:

Applied Materials Israel Ltd., Rehovot, IL;

Inventors:

Tuvia Biber, Rishon-Lezion, IL;

Efim Kerner, Rehovot, IL;

Efraim Siman Tov, Rehovot, IL;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/326 (2006.01); H01L 21/683 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); H01L 21/326 (2013.01); H01L 22/26 (2013.01);
Abstract

A system for zapping a wafer, the system may include a pulse generation unit that is configured to generate (a) first zapping pulses for causing a breakdown in a first location of a backside insulating layer of a wafer, and (b) second zapping pulses for causing a breakdown in a second location of the backside insulating layer of the wafer; a first conductive interface that is configured to convey the first zapping pulses to the first location, while contacting the first location; a second conductive interface that is configured to convey the second zapping pulses to the second location, while contacting the second location; and wherein the first location differs from the second location.


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