The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2017
Filed:
Apr. 01, 2016
Intel Corporation, Santa Clara, CA (US);
Whitney Michael Bryks, San Diego, CA (US);
Bainye Francoise Angoua, Phoenix, AZ (US);
Dilan Anuradha Seneviratne, Phoenix, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Semiconductor package substrates and methods of forming semiconductor package substrates are described. In an example, a semiconductor package substrate includes an interfacial layer between a metal layer and a dielectric layer. For example, the interfacial layer may be attached to the metal layer and the dielectric layer by a chemical bond, e.g., a coordinate bond or a covalent bond. Accordingly, the metal layer may adhere to the dielectric layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile