The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2017

Filed:

Jan. 04, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Abraham Arceo de la Pena, Albany, NY (US);

Ekmini A. De Silva, Ossining, NY (US);

Nelson M. Felix, Briarcliff Manor, NY (US);

Sivananda K. Kanakasabapathy, Niskayuna, NY (US);

Indira P. Seshadri, Troy, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/3213 (2006.01); H01L 21/033 (2006.01); H01L 21/027 (2006.01); H01L 21/311 (2006.01); H01L 21/3105 (2006.01); H01L 21/02 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32139 (2013.01); H01L 21/0228 (2013.01); H01L 21/0273 (2013.01); H01L 21/02186 (2013.01); H01L 21/02274 (2013.01); H01L 21/0331 (2013.01); H01L 21/0332 (2013.01); H01L 21/0337 (2013.01); H01L 21/31053 (2013.01); H01L 21/31111 (2013.01); H01L 21/31138 (2013.01); H01L 21/31144 (2013.01); H01L 29/66545 (2013.01);
Abstract

An organic planarization layer (OPL) is formed above a functional layer located on a substrate. A titanium-oxide layer is formed above the OPL, wherein forming the titanium-oxide layer comprises titanium, oxide, carbon, and nitrogen. A photoresist layer is patterned above a first portion of the titanium-oxide layer. A second portion of the titanium-oxide layer is removed using a wet stripping technique. The photoresist layer and the OPL are removed using a dry etch technique, wherein the first portion of the titanium-oxide layer remains over a remaining portion of the OPL. The first portion of the titanium-oxide layer and the functional layer are removed using the wet stripping technique. The remaining portion of the OPL is removed using a dry stripping technique.


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