The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

Jan. 24, 2014
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Ying-Hao Su, Hsinchu, TW;

Yu-Chung Su, Hsinchu, TW;

Yu-Lun Liu, Changhua County, TW;

Chi-Kang Chang, New Taipei, TW;

Chia-Chu Liu, Shin-chu, TW;

Kuei-Shun Chen, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/088 (2006.01); H01L 21/8234 (2006.01); H01L 21/02 (2006.01); H01L 21/027 (2006.01); H01L 29/66 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0886 (2013.01); H01L 21/0276 (2013.01); H01L 21/02118 (2013.01); H01L 21/02282 (2013.01); H01L 21/02299 (2013.01); H01L 21/02318 (2013.01); H01L 21/76837 (2013.01); H01L 21/823431 (2013.01); H01L 21/823437 (2013.01); H01L 29/66795 (2013.01);
Abstract

The present disclosure provides a method for forming a semiconductor structure. The method includes providing a substrate including a plurality of fin structures on the substrate; coating a first solution on the substrate to form a first dielectric layer; and coating a second solution on the first dielectric layer to form a second dielectric layer to cover the fin structures. The first solution has a first viscosity. The second solution has a second viscosity. In some embodiments, the second viscosity is greater than the first viscosity.


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