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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9793225 B1

PDFFull Text
Expired
Date of Patent:
Oct. 17, 2017

Filed:

Jul. 07, 2016

Thermal expansion compensators for controlling microelectronic package warpage

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Pramod Malatkar, Chandler, AZ (US);

Richard J. Harries, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Winkle, PLLC

Primary Examiner:

Yuriy Semenenko

Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/485 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/3128 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H05K 1/0271 (2013.01); H01L 23/49816 (2013.01); H01L 2224/16225 (2013.01);
Abstract

The present description relates to the field of fabricating microelectronic packages, wherein a microelectronic device may be attached to a microelectronic substrate with a compensator to control package warpage. The warpage compensator may be a low coefficient of thermal expansion material, including but not limited to silicon or a ceramic material, which is positioned on a land-side of the microelectronic device to counteract the thermal expansion effects of the microelectronic device.

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Malatkar, Pramod. (2017). Thermal expansion compensators for controlling microelectronic package warpage (U.S. Patent No. 9793225). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9793225

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