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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9793183 B1

PDFFull Text
Expired
Date of Patent:
Oct. 17, 2017

Filed:

Jul. 29, 2016

System and method for measuring and improving overlay using electronic microscopic imaging and digital processing

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Cheng-Ming Ho, Hsin-Chu, TW;

Po Shun Lin, Taichung, TW;

Venkata Sripathi Sasanka Pratapa, Hsinchu, TW;

Yi-Ju Wang, Taichung, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;

Attorney:

Haynes and Boone, LLP

Primary Examiner:

Yasser A Abdelaziez

Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/768 (2006.01); G06T 7/00 (2017.01);
U.S. Cl.
CPC ...
H01L 22/20 (2013.01); G06T 7/0004 (2013.01); H01L 21/76802 (2013.01); H01L 21/76816 (2013.01); G06T 2207/10004 (2013.01); G06T 2207/30148 (2013.01);
Abstract

An SEM image is acquired. The SEM image shows a metal line and a via hole disposed above the metal line. The via hole exposes a portion of the metal line vertically aligned with the via hole. A first portion and a second portion of the via hole are each vertically not aligned with the metal line and are disposed on opposite sides of the metal line. The acquired SEM image is processed to enhance a contrast between the first and second portions and their surrounding areas. A first dimension of the first portion and a second dimension of the second portion of the via hole are measured in a first direction. The first direction is different from a second direction along which the metal line extends. An overlay between the via hole and the metal line is determined based on the first dimension and the second dimension.

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Ho, Cheng-Ming. (2017). System and method for measuring and improving overlay using electronic microscopic imaging and digital processing (U.S. Patent No. 9793183). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9793183

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