The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

Dec. 12, 2014
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Xavier Brun, Chandler, AZ (US);

Arjun Krishnan, Chandler, AZ (US);

Mohit Mamodia, Chandler, AZ (US);

Dingying Xu, Chandler, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 21/304 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); H01L 21/304 (2013.01); H01L 21/78 (2013.01); H01L 23/562 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68331 (2013.01); H01L 2221/68377 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Some example forms relate to a stiffener tape for a wafer. The stiffener tape includes a mounting tape and a stiffener removably attached to the mounting tape. The stiffener tape further includes a die attach film attached to the stiffener. Other example forms relate to an electronic assembly that includes a wafer and a stiffener tape attached to the wafer. The stiffener tape includes a die attach film mounted to the wafer. A stiffener is attached to the die attach film and a mounting tape is removably attached to the stiffener. Still other example forms relate to a method that includes forming a stiffener tape which includes a mounting tape, a stiffener removably attached to the mounting tape and a die attach film attached to the stiffener.


Find Patent Forward Citations

Loading…