The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

Jan. 06, 2014
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd, Hsin-Chu, TW;

Inventors:

Ching-Hai Yang, Taipei, TW;

Yao-Hwan Kao, Baoshan Shiang, TW;

Shang-Sheng Li, Zhubei, TW;

Yung-Chang Lu, New Taipei, TW;

Jian-Yuan Lai, Toufen Township, Miaoli County, TW;

Kai-Yuan Cheng, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B08B 5/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67109 (2013.01); H01L 21/67028 (2013.01); B08B 5/02 (2013.01);
Abstract

Embodiments of a semiconductor processing apparatus are provided. The semiconductor processing apparatus includes a housing and a support base disposed in the housing. The semiconductor processing apparatus also includes a carrying arm movably disposed on the support base and a nozzle device disposed on the carrying arm. The semiconductor processing apparatus further includes a wafer plate disposed on the support base. When a cleaning process is performed, the carrying arm is moved toward the wafer plate, and the nozzle device emits a first gas toward the support base and the wafer plate.


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