The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

Jun. 25, 2015
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Tsung-Jen Yang, Hsinchu, TW;

Cheng-Chieh Chen, Tainan, TW;

Hong-Hsing Chou, Jhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/00 (2006.01); G01N 29/07 (2006.01); C23C 14/54 (2006.01); G01B 17/02 (2006.01); G01N 29/032 (2006.01); G01N 29/11 (2006.01); C23C 14/34 (2006.01); C23C 16/52 (2006.01); H01J 37/32 (2006.01); H01J 37/34 (2006.01);
U.S. Cl.
CPC ...
G01N 29/07 (2013.01); C23C 14/3407 (2013.01); C23C 14/54 (2013.01); C23C 16/52 (2013.01); G01B 17/02 (2013.01); G01N 29/032 (2013.01); G01N 29/11 (2013.01); H01J 37/32935 (2013.01); H01J 37/3479 (2013.01); G01N 2291/011 (2013.01); G01N 2291/015 (2013.01); G01N 2291/0237 (2013.01); G01N 2291/02854 (2013.01); G01N 2291/103 (2013.01); G01N 2291/2697 (2013.01); H01J 37/345 (2013.01);
Abstract

A system for semiconductor manufacturing that uses ultrasonic waves for estimating and monitoring a remaining service lifetime of a consumable element is provided. A consumable element comprises a front side arranged inside a process chamber and a back side, opposite the front side, arranged outside the process chamber. An ultrasonic transducer is arranged on the back side of the consumable element, and directed towards the front side of the consumable element. A monitoring unit is configured to estimate and monitor a remaining service lifetime of the consumable element using the ultrasonic transducer. A method for estimating and monitoring the remaining service lifetime of the consumable element using ultrasonic waves is also provided.


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