The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2017

Filed:

Mar. 24, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Sang-chul Youn, Suwon-si, KR;

Gyu-hee Park, Hwaseong-si, KR;

Youn-joung Cho, Hwaseong-si, KR;

Haruyoshi Sato, Tokyo, JP;

Takanori Koide, Tokyo, JP;

Naoki Yamada, Tokyo, JP;

Akio Saito, Tokyo, JP;

Akihiro Nishida, Tokyo, JP;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C07F 15/00 (2006.01); C07F 15/04 (2006.01); C09D 1/00 (2006.01); C23C 16/06 (2006.01); C23C 16/455 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
C07F 15/045 (2013.01); C09D 1/00 (2013.01); C23C 16/06 (2013.01); C23C 16/45553 (2013.01); H01L 21/28518 (2013.01); H01L 21/28556 (2013.01);
Abstract

Provided are a heterostructured nickel compound including a nickel amidinate ligand and an aliphatic alkoxy group and a method of forming a thin film including the heterostructured nickel compound. The method includes forming a nickel-containing layer on a substrate by using the heterostructured nickel compound including the nickel amidinate ligand and the aliphatic alkoxy group.


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