The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 03, 2017

Filed:

Oct. 24, 2014
Applicant:

Central Glass Company, Limited, Ube-shi, Yamaguchi, JP;

Inventors:

Makoto Seino, Fujimino, JP;

Kazuhiro Yamanaka, Tachikawa, JP;

Masafumi Oda, Fujimi, JP;

Junya Nakatsuji, Fujimino, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/075 (2006.01); C08L 83/06 (2006.01); C08G 77/18 (2006.01); C08G 77/16 (2006.01); H01L 21/027 (2006.01); C08L 83/04 (2006.01); C09D 183/04 (2006.01); G03F 7/004 (2006.01); G03F 7/023 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); G03F 7/40 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0757 (2013.01); C08G 77/16 (2013.01); C08G 77/18 (2013.01); C08L 83/04 (2013.01); C08L 83/06 (2013.01); C09D 183/04 (2013.01); G03F 7/0046 (2013.01); G03F 7/0233 (2013.01); G03F 7/168 (2013.01); G03F 7/20 (2013.01); G03F 7/322 (2013.01); G03F 7/40 (2013.01); H01L 21/0271 (2013.01);
Abstract

A positive photosensitive resin composition according to the present invention contains at least (A) a polysiloxane compound having at least a structural unit of the general formula (1), (B) a photoacid generator or quinone diazide compound and (C) a solvent[(R)RSiO]  (1)where Rrepresents the following group; Reach represents a hydrogen atom, C-Calkyl group, phenyl group, hydroxy group, C-Calkoxy group or C-Cfluoroalkyl group; b represents an integer of 1 to 3; m represents an integer of 0 to 2; n represents an integer of 1 to 3; and b, m and n satisfy b+m+n=4, where X each represents a hydrogen atom or acid labile group; and a represents an integer of 1 to 5. It is possible by the use of this positive photosensitive resin composition to provide a film with high resistance and heat-resistant transparency and provide an electronic component with such a film.


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