The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2017
Filed:
May. 04, 2016
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Inventors:
Ying-Chieh Liao, Taipei, TW;
Han-Wei Yang, Hsinchu, TW;
Chen-Chung Lai, Guanxi Township, TW;
Kang-Min Kuo, Zhubei, TW;
Bor-Zen Tien, Hsinchu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 21/768 (2006.01); H01L 23/482 (2006.01); H01L 23/528 (2006.01); H01L 29/40 (2006.01); H01L 23/29 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3171 (2013.01); H01L 21/76802 (2013.01); H01L 21/76804 (2013.01); H01L 21/76877 (2013.01); H01L 23/291 (2013.01); H01L 23/3192 (2013.01); H01L 23/481 (2013.01); H01L 23/4824 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 23/53228 (2013.01); H01L 23/564 (2013.01); H01L 29/401 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor device is disclosed in some embodiments. The device includes a substrate, and a layer disposed over the substrate. The layer includes an opening extending through the layer. A plurality of bar or pillar structures or a tapered region are arranged in a peripheral portion of the opening and laterally surround a central portion of the opening. A metal body extends through the central portion of the opening.