The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2017

Filed:

Dec. 21, 2016
Applicant:

Alpha and Omega Semiconductor Incorporated, Sunnyvale, CA (US);

Inventors:

Zhiqiang Niu, Santa Clara, CA (US);

Yan Xun Xue, Los Gatos, CA (US);

Man Sheng Hu, San Francisco, CA (US);

Jun Lu, San Jose, CA (US);

Yueh-Se Ho, Sunnyvale, CA (US);

Hamza Yilmaz, Gilroy, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 21/304 (2006.01); H01L 21/78 (2006.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01); H01L 23/31 (2006.01); H01L 23/544 (2006.01); H01L 21/66 (2006.01); H01L 21/48 (2006.01); H01L 23/495 (2006.01); H02J 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 21/304 (2013.01); H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 22/14 (2013.01); H01L 23/3114 (2013.01); H01L 23/49513 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 23/544 (2013.01); H01L 24/11 (2013.01); H01L 25/50 (2013.01); H02J 7/0029 (2013.01); H01L 2223/5446 (2013.01); H01L 2224/11318 (2013.01); H01L 2224/11849 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06582 (2013.01); H01L 2924/13091 (2013.01); H02J 2007/0039 (2013.01);
Abstract

The present invention discloses small-size battery protection packages and provides a process of fabricating small-size battery protection packages. A battery protection package includes a first common-drain metal oxide semiconductor field effect transistor (MOSFET), a second common-drain MOSFET, a power control integrated circuit (IC), a plurality of solder balls, a plurality of conductive bumps, and a packaging layer. The power control IC is vertically stacked on top of the first and second common-drain MOSFETs. At least a majority portion of the power control IC and at least majority portions of the plurality of solder balls are embedded into the packaging layer. The process of fabricating battery protection packages includes steps of fabricating power control ICs; fabricating common-drain MOSFET wafer; integrating the power control ICs with the common-drain MOSFET wafer and connecting pinouts; forming a packaging layer; applying grinding processes; forming a metal layer; and singulating battery protection packages.


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