The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2017
Filed:
May. 26, 2015
Applicant:
Stmicroelectronics, Inc., Calamba, PH;
Inventors:
Jefferson Talledo, Calamba, PH;
Godfrey Dimayuga, San Pablo, PH;
Assignee:
STMICROELECTRONICS, INC., Calamba, PH;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/20 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 25/10 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/13 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 25/105 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 2224/16055 (2013.01); H01L 2224/16057 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81191 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/35 (2013.01); H01L 2924/3511 (2013.01);
Abstract
One or more embodiments are directed to semiconductor packages, including stacked packages, with one or more cantilever pads. In one embodiment a recess is located in a substrate of the package facing the cantilever pad. The cantilever pad includes a conductive pad on which a conductive ball is formed. The cantilever pad is configured to absorb stresses acting on the package.