The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2017
Filed:
Dec. 18, 2013
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD, Hsinchu, TW;
Abstract
A semiconductor manufacturing method includes several operations. One operation is catching an image of a predetermined location on a surface of a pad installed in a chemical mechanical polishing (CMP) apparatus by a surface detector. One operation is transferring the image of the predetermined location to a processor. One operation is calculating a surface roughness value of the predetermined location from the image. One operation is comparing the surface roughness value with a threshold value by the processor to determine if the surface roughness condition at the predetermined location is smaller than the threshold value, and the surface is configured for polishing a to-be-polished surface of a wafer.