The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2017

Filed:

Sep. 25, 2015
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Hiroo Takizawa, Shizuoka, JP;

Shuji Hirano, Shizuoka, JP;

Natsumi Yokokawa, Shizuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/32 (2006.01); G03F 7/20 (2006.01); G03F 7/40 (2006.01); G03F 7/039 (2006.01); G03F 7/038 (2006.01); G03F 7/004 (2006.01);
U.S. Cl.
CPC ...
G03F 7/325 (2013.01); G03F 7/0045 (2013.01); G03F 7/0046 (2013.01); G03F 7/038 (2013.01); G03F 7/0382 (2013.01); G03F 7/0397 (2013.01); G03F 7/20 (2013.01); G03F 7/2004 (2013.01); G03F 7/2041 (2013.01); G03F 7/2059 (2013.01); G03F 7/32 (2013.01); G03F 7/405 (2013.01);
Abstract

There is provided a pattern forming method, including: (1) forming a film using an actinic ray-sensitive or radiation-sensitive resin composition, (2) exposing the film with actinic ray or radiation, (3) developing the film exposed by using a developer containing an organic solvent, wherein the actinic ray-sensitive or radiation-sensitive resin composition contains (A) a resin having a repeating unit (R) with a structural moiety capable of decomposing upon irradiation with an actinic ray or radiation to generate an acid, and (B) a solvent, and the developer contains an additive that causes at least one interaction selected from the group consisting of an ionic bond, a hydrogen bond, a chemical bond and a dipole interaction with respect to a polar group contained in the resin (A) after the exposing.


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