The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2017
Filed:
Jan. 20, 2014
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); B23K 20/02 (2006.01); H01L 23/373 (2006.01); H01L 23/40 (2006.01); H01L 23/473 (2006.01); B23K 101/40 (2006.01); B23K 103/10 (2006.01); B23K 103/12 (2006.01); B23K 103/18 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 20/02 (2013.01); H01L 23/3735 (2013.01); H01L 23/3736 (2013.01); H01L 23/4006 (2013.01); H01L 23/473 (2013.01); B23K 2201/40 (2013.01); B23K 2203/10 (2013.01); B23K 2203/12 (2013.01); B23K 2203/18 (2013.01); B23K 2203/52 (2015.10); H01L 2224/32225 (2013.01); H01L 2924/13055 (2013.01);
Abstract
The power module substrate includes a circuit layer that is formed on a first surface of a ceramic substrate, and a metal layer that is formed on a second surface of the ceramic substrate, in which the metal layer has a first aluminum layer that is bonded to the second surface of the ceramic substrate and a first copper layer that is bonded to the first aluminum layer by solid-phase diffusion bonding.