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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9764416 B1

PDFFull Text
Date of Patent:
Sep. 19, 2017

Filed:

Jan. 20, 2014

Power module substrate, heat-sink-attached power module substrate, and heat-sink-attached power module

Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Toshiyuki Nagase, Gotenba, JP;

Yoshiyuki Nagatomo, Saitama, JP;

Nobuyuki Terasaki, Saitama, JP;

Assignee:

MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;

Attorneys:

Locke Lord LLP

James E. Armstrong, IV

Nicholas J. DiCeglie, Jr.

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/00 (2006.01); B23K 20/02 (2006.01); H01L 23/373 (2006.01); H01L 23/40 (2006.01); H01L 23/473 (2006.01); B23K 101/40 (2006.01); B23K 103/10 (2006.01); B23K 103/12 (2006.01); B23K 103/18 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 20/02 (2013.01); H01L 23/3735 (2013.01); H01L 23/3736 (2013.01); H01L 23/4006 (2013.01); H01L 23/473 (2013.01); B23K 2201/40 (2013.01); B23K 2203/10 (2013.01); B23K 2203/12 (2013.01); B23K 2203/18 (2013.01); B23K 2203/52 (2015.10); H01L 2224/32225 (2013.01); H01L 2924/13055 (2013.01);
Abstract

The power module substrate includes a circuit layer that is formed on a first surface of a ceramic substrate, and a metal layer that is formed on a second surface of the ceramic substrate, in which the metal layer has a first aluminum layer that is bonded to the second surface of the ceramic substrate and a first copper layer that is bonded to the first aluminum layer by solid-phase diffusion bonding.

Find Patent Forward Citations

Nagase, Toshiyuki. (2017). Power module substrate, heat-sink-attached power module substrate, and heat-sink-attached power module (U.S. Patent No. 9764416). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9764416

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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