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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9764364 B1

PDFFull Text
Expired
Date of Patent:
Sep. 19, 2017

Filed:

Dec. 23, 2014

Apparatus and methods for movable megasonic wafer probe

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Ying-Hsueh Chang Chien, Hsin-Chu, TW;

Chin-Hsiang Lin, Hsin-Chu, TW;

Chi-Ming Yang, Hsin-Chu, TW;

Ming-Hsi Yeh, Hsin-Chu, TW;

Shao-Yen Ku, Jhubei, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Michael Kornakov

Assistant Examiner:

Ryan Coleman

Int. Cl.
CPC ...
H01L 21/30 (2006.01); B08B 3/12 (2006.01); H01L 21/67 (2006.01); B08B 3/02 (2006.01);
U.S. Cl.
CPC ...
B08B 3/12 (2013.01); B08B 3/02 (2013.01); H01L 21/6704 (2013.01); H01L 21/67028 (2013.01);
Abstract

A movable wafer probe may include: an immersion hood including a top body portion and a bottom foot portion, the top body portion having first inner sidewalls surrounding a top opening, the bottom foot portion having second inner sidewalls surrounding a bottom opening; a transducer disposed above the bottom opening and within the top opening, the transducer spaced apart from the first inner sidewalls of the top body portion by a first spacing, the first spacing forming a fluid exhaust port; and a fluid input port extending through the transducer, a bottom end of the fluid input port opening to the bottom opening.

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Chang Chien, Ying-Hsueh. (2017). Apparatus and methods for movable megasonic wafer probe (U.S. Patent No. 9764364). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9764364

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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