The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 2017

Filed:

Jun. 27, 2016
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Hyun Sik Kim, Boise, ID (US);

Irina V. Vasilyeva, Boise, ID (US);

Kyle B. Campbell, Boise, ID (US);

Kyuchul Chong, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 45/00 (2006.01); H01L 27/24 (2006.01); H01L 21/56 (2006.01); H01L 21/02 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 45/124 (2013.01); H01L 21/0214 (2013.01); H01L 21/0217 (2013.01); H01L 21/02126 (2013.01); H01L 21/02271 (2013.01); H01L 21/02348 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 25/065 (2013.01); H01L 27/2427 (2013.01); H01L 27/2463 (2013.01); H01L 45/06 (2013.01); H01L 45/065 (2013.01); H01L 45/12 (2013.01); H01L 45/126 (2013.01); H01L 45/128 (2013.01); H01L 45/1233 (2013.01); H01L 45/144 (2013.01); H01L 45/16 (2013.01); H01L 45/1675 (2013.01);
Abstract

Some embodiments include methods of forming structures. Spaced-apart features are formed which contain temperature-sensitive material. Liners are formed along sidewalls of the features under conditions which do not expose the temperature-sensitive material to a temperature exceeding 300° C. The liners extend along the temperature-sensitive material and narrow gaps between the spaced-apart features. The narrowed gaps are filled with flowable material which is cured under conditions that do not expose the temperature-sensitive material to a temperature exceeding 300° C. In some embodiments, the features contain memory cell regions over select device regions. The memory cell regions include first chalcogenide and the select device regions include second chalcogenide. The liners extend along and directly against the first and second chalcogenides.


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