The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 2017
Filed:
Jun. 28, 2016
Applicant:
Freescale Semiconductor, Inc., Austin, TX (US);
Inventors:
Michael B. Vincent, Austin, TX (US);
Jason R. Wright, Austin, TX (US);
Assignee:
NXP USA, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 25/16 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 25/162 (2013.01);
Abstract
A method for making an electronic component package from an encapsulated panel. The encapsulated panel includes two packaging substrate assembles including electronic components. Access sides of the electronic components face outward from the encapsulated panel. Standoffs separate the packaging substrate assemblies from each other.