The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2017

Filed:

Aug. 01, 2016
Applicant:

Amkor Technology, Inc., Tempe, AZ (US);

Inventors:

Ronald Patrick Huemoeller, Gilbert, AZ (US);

David Bolognia, Scottsdale, AZ (US);

Robert Francis Darveaux, Gilbert, AZ (US);

Brett Arnold Dunlap, Queen Creek, AZ (US);

Assignee:

Amkor Technology, Inc., Tempe, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01D 11/24 (2006.01); H01L 27/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); G06K 9/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3128 (2013.01); G06K 9/0002 (2013.01); G06K 9/00053 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 24/17 (2013.01); H01L 24/19 (2013.01); H01L 24/96 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01);
Abstract

A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.


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