The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2017
Filed:
Aug. 18, 2015
Applicant:
Amkor Technology, Inc., Tempe, AZ (US);
Inventors:
Dong Jin Kim, Gwangju, KR;
Jin Han Kim, Gyeonggi-do, KR;
Se Woong Cha, Gyeonggi-do, KR;
Ji Hun Lee, Seoul, KR;
Joon Dong Kim, Gwangju, KR;
Yeong Beom Ko, Gwangju, KR;
Assignee:
Amkor Technology, Inc., Tempe, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/70 (2006.01); H01L 25/00 (2006.01); H01L 23/31 (2006.01); H01L 25/10 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 21/561 (2013.01); H01L 23/3128 (2013.01); H01L 25/105 (2013.01); H01L 21/486 (2013.01); H01L 21/568 (2013.01); H01L 23/49811 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/97 (2013.01); H01L 2924/181 (2013.01);
Abstract
A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.