The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2017

Filed:

Nov. 24, 2015
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Kenji Sugakawa, Koshi, JP;

Yuji Mimura, Koshi, JP;

Shuhei Matsumoto, Koshi, JP;

Takahiro Masunaga, Koshi, JP;

Makoto Tsukishima, Sapporo, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/66 (2006.01); H01L 23/00 (2006.01); H01L 21/68 (2006.01); H01L 21/822 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67248 (2013.01); H01L 21/67092 (2013.01); H01L 21/681 (2013.01); H01L 22/20 (2013.01); H01L 24/75 (2013.01); H01L 24/80 (2013.01); H01L 24/94 (2013.01); H01L 21/8221 (2013.01); H01L 22/12 (2013.01); H01L 24/08 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/7501 (2013.01); H01L 2224/759 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75301 (2013.01); H01L 2224/75601 (2013.01); H01L 2224/75702 (2013.01); H01L 2224/75704 (2013.01); H01L 2224/75705 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/75753 (2013.01); H01L 2224/75802 (2013.01); H01L 2224/75804 (2013.01); H01L 2224/75822 (2013.01); H01L 2224/75823 (2013.01); H01L 2224/75824 (2013.01); H01L 2224/75981 (2013.01); H01L 2224/80003 (2013.01); H01L 2224/80013 (2013.01); H01L 2224/8013 (2013.01); H01L 2224/80048 (2013.01); H01L 2224/80132 (2013.01); H01L 2224/80201 (2013.01); H01L 2224/80894 (2013.01); H01L 2224/80908 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/94 (2013.01);
Abstract

There is provided a method of bonding substrates to each other, which includes: holding a first substrate on a lower surface of a first holding part; adjusting a temperature of a second substrate by a temperature adjusting part to become higher than a temperature of the first substrate; holding the second substrate on an upper surface of a second holding part; inspecting a state of the second substrate by imaging a plurality of reference points of the second substrate with a first imaging part, measuring positions of the reference points, and comparing a measurement result with a predetermined permissible range; and pressing a central portion of the first substrate with a pressing member, bringing the central portion of the first substrate into contact with a central portion of the second substrate, and sequentially bonding the first substrate and the second substrate.


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