The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

May. 12, 2016
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Andrea Redaelli, Casatenovo, IT;

Agostino Pirovano, Milan, IT;

Umberto Maria Meotto, Rivoli, IT;

Giorgio Servalli, Fara Gera d'Adda, IT;

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 45/00 (2006.01); H01L 27/24 (2006.01); H01L 23/525 (2006.01);
U.S. Cl.
CPC ...
H01L 45/06 (2013.01); H01L 23/5256 (2013.01); H01L 27/2445 (2013.01); H01L 27/2463 (2013.01); H01L 45/12 (2013.01); H01L 45/126 (2013.01); H01L 45/1226 (2013.01); H01L 45/1233 (2013.01); H01L 45/144 (2013.01); H01L 45/16 (2013.01); H01L 45/1675 (2013.01); H01L 45/1683 (2013.01);
Abstract

A resistive random access memory array may be formed on the same substrate with a fuse array. The random access memory and the fuse array may use the same active material. For example, both the fuse array and the memory array may use a chalcogenide material as the active switching material. The main array may use a pattern of perpendicular sets of trench isolations and the fuse array may only use one set of parallel trench isolations. As a result, the fuse array may have a conductive line extending continuously between adjacent trench isolations. In some embodiments, this continuous line may reduce the resistance of the conductive path through the fuses.


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