The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2017
Filed:
Dec. 23, 2013
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Qinglei Zhang, Chandler, AZ (US);
Sri Ranga Sai Boyapati, Chandler, AZ (US);
Assignee:
INTEL CORPORATION, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/06 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/181 (2013.01);
Abstract
In embodiments, a package assembly may include a die coupled with one or more conductive pads. A barrier layer may be directly coupled with and between the die and one or more of the conductive pads. The package assembly may further include a solder resist layer coupled with the die and the conductive pads, and one or more interconnects positioned at least partially within the solder resist layer and directly coupled with one or more of the conductive pads.