The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

May. 27, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Daniele Caimi, Besenbueren, CH;

Lukas Czornomaz, Zurich, CH;

Jean Fompeyrine, Waedenswil, CH;

Emanuele Uccelli, Rueschlikon, CH;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 21/00 (2006.01); H01L 21/02 (2006.01); H01L 29/66 (2006.01); H01L 29/20 (2006.01); H01L 29/78 (2006.01); H01L 29/32 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02694 (2013.01); H01L 21/02502 (2013.01); H01L 21/02516 (2013.01); H01L 21/02546 (2013.01); H01L 21/02645 (2013.01); H01L 29/20 (2013.01); H01L 29/32 (2013.01); H01L 29/66522 (2013.01); H01L 29/66795 (2013.01); H01L 29/7851 (2013.01);
Abstract

A semiconductor substrate is a provided and an insulating layer is formed thereon. A cavity structure is formed above the insulating layer, including a lateral growth channel and a fin seed structure arranged in the lateral growth channel. The fin seed structure provides a seed surface for growing a fin structure. One or more first semiconductor structures of a first semiconductor material and one or more second semiconductor structures of a second, different, semiconductor material are grown sequentially in the growth channel from the seed surface in an alternating way. The first semiconductor structures provide a seed surface for the second semiconductor structures and the second semiconductor structures provide a seed surface for the first semiconductor structures. The second semiconductor structures are selectively etched, thereby forming the fin structure comprising a plurality of parallel fins of the first semiconductor structures. Corresponding semiconductor structures are also included.


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