The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2017

Filed:

Jun. 20, 2012
Applicants:

Atsushi Kobayashi, Miyagi, JP;

Kazuyuki Miura, Miyagi, JP;

Akira Yasumuro, Miyagi, JP;

Inventors:

Atsushi Kobayashi, Miyagi, JP;

Kazuyuki Miura, Miyagi, JP;

Akira Yasumuro, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F27D 11/00 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32467 (2013.01); H01J 37/32522 (2013.01); H01J 37/32532 (2013.01);
Abstract

A semiconductor manufacturing apparatus is capable of reducing power consumption. The semiconductor manufacturing apparatusincludes a processing chamberthat has a top surfaceand forms a processing space S therein; a mounting tableprovided in the processing space S; an upper electrodeprovided above the mounting tableto face the mounting table; heatersandprovided around the upper electrodeand below the top surfaceof the processing chamberand configured to heat the upper electrode; and a heat insulating unit, mounted on the top surfaceof the processing chamber, having a plate-shaped memberand a heat insulating memberthat is provided on one main surfaceof the plate-shaped member


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