The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2017
Filed:
Aug. 24, 2011
Takashi Tanaka, Nirasaki, JP;
Yusuke Saito, Nirasaki, JP;
Mitsuaki Iwashita, Nirasaki, JP;
Takayuki Toshima, Koshi, JP;
Takashi Tanaka, Nirasaki, JP;
Yusuke Saito, Nirasaki, JP;
Mitsuaki Iwashita, Nirasaki, JP;
Takayuki Toshima, Koshi, JP;
TOKYO ELECTRON LIMITED, Tokyo, JP;
Abstract
A plating apparatuscan perform plating processes by supplying plating liquids onto a surface of a substrate. The plating apparatusincludes a substrate rotating holder configured to hold and rotate the substrate; plating liquid supply unitsandconfigured to supply different kinds of plating liquids onto the surface of the substrate; a plating liquid drain unitconfigured to drain out the plating liquids dispersed from the substratedepending on the kinds of the plating liquids; and a controllerconfigured to control the substrate rotating holder, the plating liquid supply unitsand, the plating liquid drain unit. While the substrateis held and rotated, the plating processes are performed on the surface of the substratein sequence by supplying the different kinds of the plating liquids onto the surface of the substrate