The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2017
Filed:
Sep. 28, 2016
Applicant:
Globalfoundries Singapore Pte. Ltd., Singapore, SG;
Inventors:
Wanbing Yi, Singapore, SG;
Juan Boon Tan, Singapore, SG;
Mahesh Bhatkar, Singapore, SG;
Danny Pak-Chum Shum, Singapore, SG;
Assignee:
GLOBALFOUNDRIES SINGAPORE PTE. LTD., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 21/66 (2006.01); H01L 23/31 (2006.01); H01L 23/485 (2006.01); H01L 43/08 (2006.01);
U.S. Cl.
CPC ...
H01L 22/32 (2013.01); H01L 23/10 (2013.01); H01L 23/3171 (2013.01); H01L 23/485 (2013.01); H01L 43/08 (2013.01);
Abstract
A semiconductor chip includes an active area including a plurality of integrated circuit structures, a seal ring enclosing the active area, a corner area of the semiconductor chip that is outside of the seal ring, and an electronic test structure disposed within the corner area. Semiconductor wafers including the above-noted semiconductor chips, as well as methods for fabricating semiconductor wafers including the above-noted semiconductor chips, are also disclosed.