The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2017

Filed:

Feb. 27, 2015
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Masanori Itou, Koshi, JP;

Ryoichi Sakamoto, Koshi, JP;

Takashi Sakaue, Kikuchi-gun, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); B32B 43/00 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
B32B 43/006 (2013.01); H01L 21/67092 (2013.01); H01L 21/6838 (2013.01); B32B 2457/14 (2013.01); H01L 2221/6839 (2013.01); Y10S 156/93 (2013.01); Y10S 156/941 (2013.01); Y10T 156/1132 (2015.01); Y10T 156/1168 (2015.01); Y10T 156/1179 (2015.01); Y10T 156/1184 (2015.01); Y10T 156/1944 (2015.01); Y10T 156/1961 (2015.01); Y10T 156/1967 (2015.01); Y10T 156/1978 (2015.01);
Abstract

A delamination method for delaminating a laminated substrate which includes a first and a second substrates bonded to each other, includes: adjusting a position of the laminated substrate at a holding unit by a position adjusting unit and disposing the holding unit at a predetermined height position; disposing a sharp member of a delamination inducing unit at a predetermined height position; detecting a contact of the sharp member by bringing the sharp member into contact with a side surface of one end portion of the laminated substrate; inserting the sharp member into the side surface of the one end portion of the laminated substrate; and delaminating the second substrate from the first substrate by a plurality of suction movement units which sucks the second substrate of the laminated substrate to move the second substrate away from the first substrate.


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