The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2017
Filed:
Mar. 29, 2013
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 3/10 (2006.01); H01L 23/373 (2006.01); B23K 20/02 (2006.01); B23K 20/233 (2006.01); C04B 37/02 (2006.01); H01L 23/473 (2006.01); B23K 103/10 (2006.01); B23K 103/12 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0201 (2013.01); B23K 20/02 (2013.01); B23K 20/023 (2013.01); B23K 20/2333 (2013.01); C04B 37/026 (2013.01); H01L 23/3735 (2013.01); H05K 1/092 (2013.01); H05K 1/18 (2013.01); H05K 1/181 (2013.01); H05K 3/103 (2013.01); B23K 2203/10 (2013.01); B23K 2203/12 (2013.01); C04B 2237/124 (2013.01); C04B 2237/343 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/402 (2013.01); C04B 2237/704 (2013.01); C04B 2237/706 (2013.01); C04B 2237/708 (2013.01); H01L 23/473 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83192 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/13055 (2013.01); Y10T 29/49155 (2015.01);
Abstract
A power module substrate includes a circuit layer, an aluminum layer arranged on a surface of an insulation layer, and a copper layer laminated on one side of the aluminum layer. The aluminum layer and the copper layer are bonded together by solid phase diffusion bonding.