The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2017

Filed:

Jun. 09, 2016
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Ruilong Xie, Schenectady, NY (US);

Catherine B. Labelle, Schenectady, NY (US);

Min Gyu Sung, Latham, NY (US);

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/10 (2006.01); H01L 29/66 (2006.01); H01L 21/3065 (2006.01); H01L 21/308 (2006.01); H01L 29/78 (2006.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1037 (2013.01); H01L 21/3065 (2013.01); H01L 21/3081 (2013.01); H01L 21/3085 (2013.01); H01L 21/3086 (2013.01); H01L 29/16 (2013.01); H01L 29/66795 (2013.01); H01L 29/7851 (2013.01);
Abstract

Formation of semiconductor structures employing selective removal of fins includes, for example, providing a substrate having a first plurality of fins having first hard masks thereon, a second plurality of fins having second hard masks thereon, the first hard mask being different from the second hard mask, depositing a first fill material between lower portions of the first and second fins, depositing a third hard mask layer on the first fill material between the first and second fins, depositing a second fill material on the third hard mask extending between upper portions of the first and second fins, selectively removing the second hard masks and the second fins to form open cavities in the first and second fill material, depositing a third fill material in the opened cavities, and removing the second fill material and the third fill material above the third hard mask to form a fin-cut region.


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