The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2017
Filed:
Sep. 22, 2015
Applicant:
Industrial Technology Research Institute, Hsinchu, TW;
Inventors:
Kuan-Wei Chen, Taichung, TW;
Pei-Jer Tzeng, Hsinchu County, TW;
Chien-Chou Chen, Hsinchu, TW;
Po-Chih Chang, Changhua County, TW;
Assignee:
Industrial Technology Research Institute, Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 29/06 (2006.01); H01L 21/78 (2006.01); H01L 21/50 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 21/50 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 29/0657 (2013.01); H01L 23/544 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2223/5446 (2013.01); H01L 2223/54426 (2013.01);
Abstract
A bonding structure including a first substrate, a second substrate, and an adhesive layer is provided. The first substrate has a plurality of first trenches. The adhesive layer is located between the first substrate and the second substrate, and the first trenches are filled with the adhesive layer.